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| MIH Series 5mm X 7mm Ceramic SMD * Ceramic SMD Package * 5.0, 3.3, 2.5, and 1.8 Volt * HCMOS/TTL Compatible Output * Stability to 10ppm * Tape and Reel Packaging Electrical Specifications Frequency Range 5V and 3.3V 2.5V 1.8V Frequency Stability (Inclusive of Temperature, Load, Voltage and Aging) Operating Temperature Range Storage Temperature Range Supply Voltage (Vdd) 5% Supply Current Vdd = 5V Vdd = 3.3V Vdd = 2.5V Vdd = 1.8V Output Voltage HCMOS Logic 0 Logic 1 Duty Cycle 50% of waveform Load Drive Capability 5V(less than 50MHz) 5V(greater than 50MHz) 3.3V(less than 50MHz) 3.3V(greater than 50MHz) 2.5V 1.8V Rise / Fall Time Start Up Time Jitter RMS *Please contact your MMD representative for up-to-date typical jitter information 1.500MHz to 156.250MHz 1.500MHz to 70.000MHz 1.544MHz to 40.000MHz 100ppm to 10ppm 0C - 70C to -40C - 85C -55C - 125C 5.0Vdc, 3.3Vdc, 2.5Vdc, or 1.8Vdc 70mA max. 40mA max. 35mA max. 15mA max. 10% Vdd max. 90% Vdd min. 40%/60% max. or 45%/55% max. 10 TTL Gates or 50pF 10 TTL Gates or 15pF 10 TTL Gates or 30pF 10 TTL Gates or 15pF 10 TTL Gates or 15pF 10 TTL Gates or 15pF 4nSec max. 10mSec max. 10pSec max.* www.mmdcomp.com phone: 949-709-5075 / fax: 949-709-3536 Specifications subject to change without notice OS11 Revision: 4/20/04 I Part Numbering Guide MI 5X7 Ceramic SMD H Frequency Stability 100 = 100ppm 050 = 50ppm 025 = 25ppm 020 = 20ppm 015 = 15ppm 010 = 10ppm** Operating Temperature Blank = 0C to 70C 27 = -20C to 70C** 48 = -40C to 85C** Output H = HCMOS H Frequency Pin 1 Connection H = Tri-state T&R Supply Voltage Blank = 5 Volt 3 = 3.3 Volt 2 = 2.5 Volt*** 1 = 1.8 Volt**** Packaging* Blank = Bulk T&R = Tape and Reel Symmetry Blank = 40%/60% A = 45%/55% *See page VA4 for Tape Specifications **Not available in 2.5V and 1.8V *** Available to 70MHz only **** Available to 40MHz only Mechanical Dimensions 2.6 0.15 .102 .006 4 1 3.68 0.15 .145 .006 2.88 .113 4 5.0 0.2 .197 .008 7.0 0.2 .278 .008 3 1.7 max .067 max 5.08 0.15 .200 .006 1.2 0.2 .047 .008 2 1.4 0.1 .055 .004 Markings 1 3 2 Pad Connections Tri-state Operation Logic 1 or NC = Oscillation Logic 0 or GND = High Impedance Suggested Solder Pad Layout Pin 2: Ground / Case Pin 3: Output P i n 4 : S u p p l y Vo l ta g e 2.0 .079 2.2 .087 Environmental / Mechanical Markings Shock: MIL-STD-883, Method 2002, Condition B Solderability: MIL-STD-883, Method 2003 Solvent Resistance: MIL-STD-202, Method 215 Vibration: MIL-STD-883, Method 2007, Condition A Gross Leak Test: MIL-STD-883, Method 1014, Condition C Fine Leak Test: MIL-STD-883, Method 1014, Condition A2 Line 1: MMD "Date Code" Line 2: Frequency www.mmdcomp.com phone: 949-709-5075 / fax: 949-709-3536 OS11 Specifications subject to change without notice Revision: 4/20/04 I 1.81 .071 P i n 1 : Tr i - Sta t e Solder Pad (X4) |
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